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  • Method of calculating the effect of thermal stress on the dynamic characteristics of MEMS

    The method of calculating the effect of thermal stress on the dynamic characteristics of inertial microelectromechanical systems (MEMS) is presented in this article. Testing was conducted on a technique of vibrating gyroscope LL type electrostatic actuator in a temperature range from -40 to 80 ° C. It is shown that the thermoelastic stresses lead to a shift in the natural oscillation frequencies and the change of amplitude-frequency characteristics of the system. Method of calculation is based on the sequential solution of differential equations of heat conduction and the generalized Hooke's law, taking into account thermal stresses. Modal analysis and construction of MEMS amplitude-frequency characteristics is performed considering prestressed calculated in the previous step.

    Keywords: microelectromechanical systems, micromechanical gyroscope, thermoelastic stresses, temperature errors, numerical simulation, frequency response

  • Research of Nd:YAG laser processing on intense the deformed conditions in semiconductor structure

    Results of research of influence of  processing operations of Nd:YAG of the laser are presented in article, such as the speed of scanning and power of a laser beam on maximum temperature and the thermodeformed status in structure dye-sensitized solar cell. Dependences a component of a tensor of tension are received at various processing operations by means of numerical experiment. Results of researches showed that in intense the deformed status is depend on  temperature gradient more, then on coefficients of linear expansion of structure which in this structure differ slightly.

    Keywords: laser technologies, thermodeformed, numerical simulation