The key parameter of any cooling system is the heat transfer coefficient. The article deals with the issue of studying the dependence of the thermal resistance of the heat exchanger of a liquid cooling system based on ferrofluids and the heat transfer coefficient on the parameters of the fluid flow and the magnetic field in the heat exchanger. The study was carried out by numerical simulation and thermophysical experiment. A feature of the considered cooling system is the coolant. A ferromagnetic liquid based on Fe3O4 magnetites and propylene glycol is used as a coolant. As a result, a numerical model for calculating the heat transfer coefficient for an experimental liquid cooling system is obtained. The influence of the magnetic field on the thermal resistance of the system and the heat transfer coefficient of the wall-liquid at various magnitudes of the magnetic field strength is estimated. An experimental dependence has been obtained showing an increase in the heat transfer coefficient up to 12.5% when a magnetic field is applied.

Keywords: numerical model of heat transfer, liquid cooling system, Laplace equation, thermal management, CPU, ferrofluid, percolation, heat transfer coefficient, nanofluid, magnetic field, electronics cooling

In this research the research problem of the liquid cooling system of supercomputer processors on nanomagnetic liquids by numerical modeling and the pilot study of processes of heat convection in the studied object is set. In article results of numerical modeling and the pilot study of process of the heat transfer are given in the heat exchanger of the liquid cooling system of supercomputer processors on the basis of nanomagnetic liquids, or ferroflyuid at influence of magnetic field impact assessment of magnetic field on the thermal resistance of the system and coefficient of heat convection the wall liquid Is made at different strengths of magnetic field. The numerical model of process of the heat transfer in the system the processor heat exchanger was investigated.

Keywords: processor, thermal resistance, Laplace equation, liquid computer cooling system, ferrofluid, nanomagnetic liquid, heat transfer, heat transfer coefficient

In This study posed the problem of simulating the cooling system of supercomputers with a heat pump on the reverse Stirling cycle by numerical modeling of heat transfer processes in the object under study. The article presents the results of numerical simulation of heat transfer processes in the cooling system of processors of supercomputers with a heat pump on the reverse Stirling cycle. A numerical model of the heat transfer process was investigated. Using the method of numerical simulation of the heat transfer process, the dependences of the temperature delta, thermal resistance and the fraction of losses of the heat pump of the cooling system are obtained. The dependence of the ratio of the stroke of the piston to the diameter of the piston H / D of the heat pump has been revealed, taking into account the loss of the thermal resistance of the liquid cooling circuits and the elements of the design of the heat pump.

Keywords: processor, heat flow, thermal resistance, Laplace equation, heat pump, heat exchange, Stirling backflow, cooling system

The article considers the experimental estimation of the heat transfer coefficient in a hybrid immersion cooling system with contact point cooling and dry zones. The change in the heat transfer coefficient is made through a change in the Reynolds number for the flow of the coolant in the immersion cooling system. The experimental investigation is carried out on the basis of a numerical simulation model of the process under study. As a result, the dependences of the thermal resistance of the processor-heat exchanger system on the heat transfer coefficient and on the Reynolds number of the turbulent flow were obtained, and the results with the simulation results were estimated. It is found that, with an increase in the Reynolds number, the heat transfer intensification is weaker than the theoretical one. The refinement coefficients for the case under consideration are found.

Keywords: processor, heat flow, thermal resistance, Laplace equation, turbulent flow, Reynolds number, heat transfer, immersion cooling system, immersion cooling system, cavitation

In this study, the task is to simulate the cooling system of supercomputers with a heat pump on the reverse Stirling cycle by numerical simulation of heat transfer processes in the object under study. The results of numerical simulation of heat transfer processes in the superheater processor cooling system with a heat pump on the reverse cycle are presented. A numerical model of the heat transfer process was investigated. As a result, the dependencies of the required thermal lift of the heat pump are obtained taking into account the thermal resistance of the system. The first liquid cooling circuit - the cold cylinder of the heat pump and the hot cylinder system - the second liquid cooling circuit, depending on the heat transfer coefficient of the heat pump.

Keywords: processor, heat flow, thermal resistance, Laplace equation, heat pump, heat exchange, Stirling backflow, cooling system

In this study, the task of optimization of the hybrid system of immersion cooling processor supercomputer with resistance spot cooling and dry zones. by numerical simulation and experimental study of heat transfer processes in the test object. The article presents the results of numerical simulation and experimental study of heat transfer in a heat exchanger submerged cooling system processors. We investigated the numerical model of heat transfer process in the processor-heat exchanger system. As a result, obtained according to the thermal resistance of the system processor and the heat exchanger of the heat transfer coefficient and the number of turbulent flow Reynolds.

Keywords: processor, heat flow, thermal resistance, Laplace equation, turbulent flow, the Reynolds number, heat, immersion cooling, immersion cooling system

In this study, the task of optimizing the supercomputer CPU cooling system with a heat pump in the reverse Stirling cycle through numerical modeling of heat transfer processes in the test object The article presents numerical modeling of heat transfer processes in the cooling system of the supercomputer processors with a heat pump on the return cycle. We investigated the numerical model of heat transfer process in the system of CPU "cold" cylinder and heat pump system "hot cylinder" - coolant. As a result, obtained according to the thermal resistance of the system of CPU "cold" cylinder and heat pump system "hot cylinder" - coolant depending on the coefficient of heat transfer and on the value of COP of the heat pump

Keywords: processor, heat flow, the thermal resistance of the Laplace equation, heat pump, heat exchange, reverse Stirling cycle cooling system

Low heat transfer coefficient per unit area is main disadvantage of immersion cooling system. In the theoretical part of the study the main issue was to evaluate the influence of various factors on the convective heat transfer between the solid-liquid interface. The result of this part of study was conclusion that the type of fluid flow in the area of heat transfer is key factor of increase heat convective heat transfer of thermal contact. The Reynolds number is main characteristic of turbulence of fluid flow. Therefore in the experimental part describes study of the effect of the degree of turbulence of the fluid flow at the place of the thermal contact on thermal resistance of immersion cooling system. The design of experimental setup and its main parts is describe further. The result of the experiment is graphic of experimental curve of the thermal resistance of immersion cooling system from the Reynolds number of fluid flow of thermal contact between the solid-liquid interface. The study showed the possibility of local reduction of the thermal resistance of immersion cooling systems to maintain the quality of the thermal management of computing elements that emit significant heat. The results of the study is define the ranges of values of the Reynolds number of cooling system that allows the technical realization at the current dimensions of packages and sizes of microchips sockets.

Keywords: microchip, heat flow, cooling system, Laplace's equation, turbulent flow, Reynolds number, heat transfer, thermal resistance, electrothermal analogy, thermal protection